Model NO.: HDR433M-B13
Appliacation: RF Module. Remote Control, Wireless Pager, Alarm
Transport Package: Carton
HS Code: 854190000
Â TheÂ strong pointÂ for CSP(chip size package) resonator (HDR433M-B13).
1. AdoptingÂ the mostÂ advanced flip chip technology, flipping the chip on the package after bump bonding , then using theÂ ultrasonic Â technology to connect the input and output pin.
This process can greatly reduce theÂ fault rate caused by circuit-short orÂ Â circuit-break.
2. Chip-size package--Â SMD 2.0*1.6mm.
They can meet the needs of miniaturized products.
3. Competitive price.Â Â
As real SMD-type resonatorÂ ,Â Â their price is only half of similarÂ SMD3030 or SMD 5035 series ,Â
TheyÂ can be used as a low-cost solution for the users, while greatly reduce the labor costs of traditional DIP series.
Â 4. Large manufacturing capacityÂ and Short Lead TimeÂ .Â
Our lead time for CSP resonator is only one week, because they are produced by fully automatic equipment.
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